BGA and Board Repair
100% 3D X-Ray affords you with the assurance of the highest
degree of quality workmanship.
The MJS Designs' team repairs boards, from simple component removal to complex edits. Our experienced rework technicians have an extensive background in advanced packaging, which includes removal and replacement of CCGA’s, BGAs, uBGAs, CSPs, LGAs, QFNs, Interposers, Specialized Pin Adapters, Package on Package (PoP) and BGA type connectors. State of the art equipment, combined with our breadth of knowledge enables us to accommodate component pitches as small as 0.4mm to 1.27mm on components ranging from 4mm to 53mm with leaded or RoHS requirements. 3D X-Ray inspection assures that even the most complex or smallest of boards are checked for integrity.
We accommodate advanced packaging assembly with component pitches as small as 0.4mm.
- Removal/Replacement Capabilities:
- Surface Mount 01005 to 1950+ BGA, LGA, QFN, POP, uBGA
- Component Placement up to 250 um
- MicroBGA Placement at 0.4mm Pitch
- 3D X-Ray Validation of BGA and X-Ray Service
- Leaded and Lead-Free Rework Processes
- Solder Sphere Attachment, Removal, Replacement
We repair lead free and leaded projects!
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MJS Designs, Inc.
4130 E. Wood Street,
Suite 100
Phoenix,
AZ 85040
Phone (602) 437-5068
Fax (602) 437-5299
(800) 445-9442
info@mjsdesigns.com
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